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| Place of Origin: | china |
| اسم العلامة التجارية: | JIMA |
| إصدار الشهادات: | SGS, ISO,Reach, RoHS |
| Model Number: | EDCU-HC |
| Minimum Order Quantity: | 100kg |
|---|---|
| الأسعار: | negotiation |
| Packaging Details: | wooden carton |
| Delivery Time: | 5-15 days |
| Payment Terms: | T/T, L/C |
| Supply Ability: | 1000 Ton per month |
| مضاد للأكسدة: | 180 درجة 60 دقيقة 180 يوم 23 درجة | استطالة: | ≥ 1.5٪ |
|---|---|---|---|
| قوة الشد: | ≥ 160 ميجا باسكال | قوة قشر: | ≥ 1 نيوتن / مم |
| الملف احباط: | RA≤0.15μm ， Rz≤1.7μm | الطول لكل لفة: | 500 - 5000 متر |
| تسليط الضوء: | electrodeposited copper foil,copper thin sheet,copper thin sheet |
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FR-4 zinc-free 3/4 OZ red HTE electrodeposited copper foil for CCL
Feature:
- Being used in the production of the different double-face and multi-player printed circuit boards.
- Perfect physical characteristic of the fine and uniform crystal structure.
- Low profile, the high intensity,high peel strength.
Specification as follow:
. Thickness: 3/4 OZ, 25 mic.
. Quality standard:IPC 4562.
. Small coil.
. Jumbo coil.
Classify:
(HD-E)-high ductility electrodeposited copper foil.
(HTE-E)-high temperature elongation electrodeposited copper foil.
(LP-E)-low profile electrodeposited copper foil.
Application:
1. Epoxy board.
2. PCB ,antenna PCB,PCB industry
So what the differences between rolled copper foil and ED copper foil
rolled copper foil higher density, the surface is relatively smooth, conducive to the production of printed circuit board after the rapid transmission of the signal, so high-frequency high-speed transmission, fine lines printed circuit board also used some calendering copper Foil.
HTE copper foil with high elongation copper foil at high temperature
| Thickness | um | 9 | 12 | 18 | 25 | 35 | 70 |
IPC 4562 4.6.3.1
|
|
| Area weight | g/m² | 80±1 | 107±3 | 153± | 215±5 | 285±5 | 585±8 |
IPC 4562 4.6.3.2 |
|
| Roughness | (RA) | μm | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 |
IPC 4562 4.6.9 |
| (RZ) | μm | <6.0 | <6.5 | <8.0 | <9.0 | ≤10.0 | <15 | ||
|
Copper≧ |
% | 99.8 |
IPC 4562 4.6.3.1
|
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| Tensile Strength | state normal | Mpa | >300 | >300 | >300 | >300 | >300 | >280 |
IPC 4562 4.6.4 |
| state temper (180℃) | Mpa | >15.0 | >18.0 | >18.0 | >18.0 | >18.0 | >18.0 | ||
| ElongationI | state normal | % | >3.0 | >3.0 | >5.0 | >6.0 | >10.0 | >10.0 |
IPC 4562 3.5.3 |
| state temper (180℃) | % | >2.0 | >2.5 | >2.5 | >3.0 | >5.0 | >5.0 | ||
| Peel strength | N/mm | >1.0 | >1.05 | >1.35 | >1.70 | >1.8 | >2.0 |
IPC 4562 4.6.7 |
|
|
High temperature oxidation resistance(200℃, 40min) |
No color change | Standard | |||||||
| Solderability | Good | Standard | |||||||
| Solderability | Good |
IPC 4562 4.6.12 |
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اتصل شخص: JIMA Annie
